Blade Dicing Systems:
Fully auto or semi auto; single spindle or dual spindle dicing saws give the highest throughput and utilisation possible.
Mahoh Laser Dicer:Giving the cleanest cut possible the Mahoh dicer has special properties that makes it ideal for MEMs devices.
Dicing Service:A dicing service is available for people who need to only run a few wafers. Contact us for details
Dicing Blades:We have many different types of blades depending on grit type, lattice material and even putting an angle on the blade. All can improve performance and reduce costs - resin bonded or metal bonded, hubbed or hubless. - Just give us call for a sample!
News & Product Showcase
Diamaflow has been a product waiting for the market to arrive. Having started with Diamaflow more than a decade ago with only a few specific device types Diamaflow has won world wide recognition as a leader in its field and is now the material of choice for many of the major IDM's and sub contractors.
Keeping bond pads clean increases bond pad strength leading to improved reliability. Smaller bond pads mean higher effective currents causing premature failure of devices.
Depending on your metals, corrosion cells are quick to attack your devices. Keeping the dust suspended prevent the corrosion cell being created.