TDK

AFM-1500

Flip Chip Bonder TDK Model: AFM-1500 Vintage: 2005 Location: Central America Configuration: • Maximum Wafer Size: 8 Inches • Does NOT include computer seen on top of machine • CE marked: NO • Type of Media Handler: WAFER • Voltage:200 VOLTS • Frequency:50/60 HERTZ • Phase:3 • Current:30 AMPS • Recommended Packaging Form: CRATE Model: AFM-1500 Vintage: 2005 • Maximum Wafer Size: 8 Inches • Does NOT include computer seen on top of machine • CE marked: NO • Type of Media Handler: WAFER • Voltage:200 VOLTS • Frequency:50/60 HERTZ • Phase:3 • Current:30 AMPS • Recommended Packaging Form: CRATE

AFM-1503

Flip Chip Bonder Maximum Wafer Size: 8 Inches • Does NOT include computer seen on top of machine • CE marked: NO • Type of Media Handler: WAFER • Voltage:200 VOLTS • Frequency:50/60 HERTZ • Phase:3 • Current:30 AMPS • Recommended Packaging Form: CRATE

AFM-1503

Flip Chip Bonder

AFM-1503

Flip Chip Bonder

AFM-1503

Flip Chip Bonder

AFM-1505

Flip Chip Bonder Manufacturer: TDK Model: AFM-1505 Vintage: 2017 Location: America Quantity: 9 Configuration: • CE marked: NO • Type of Media Handler: WAFER • Voltage:200 VOLTS • Frequency:50/60 HERTZ • Phase:3 • Current:30 AMPS • Recommended Packaging Form: CRATE • o Overall: 63 x 53 x 86 IN - 3527 LBS o Metric o .1600.20 x 1346.20 x 2184.40 mm - 1599.85 kg

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder

AFM-1505

Flip Chip Bonder