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Karl Suss - PM8
SET (Suss Microtec) - FC300
Flip Chip Bonder
Suss - FC300
Suss Microtech FC300 Flipchip Suss Microtec Model: FC300 Vintage: 2011 Location: Asia Inspectability: Yes, can be inspected Configuration: • Currently Configured for 300mm wafer size • Key Features: o Chip to wafer thermal compression bonder (TCB), wafer up to Φ300mm o High force and high accuracy bonder o Capable for Cu-Cu bonding with capability of Formic acid for oxide removal • Additional: - o Upgrade Set Dispenser 3DI o Inventory Note: 1168157 o Original PO Detail Description: o SET FC 300 Description Lines o Line # 2 - SET FC 300 - Feeding Module o Line # 3 - Force Measurement -40N o Line # 4 - Force Measurement - 500N o Line # 5 - Bonding Head- Semi-Open Confinement 22M o Line # 6 - Substrate Heating Chuck 300mm o Line # 7 - Bonding Tool 22mm (Flat or Pedestal) o Line # 8 - Fluid Dispenser Jet System (Piston Type) o Line # 9 - Chip Solder Flux or Epoxy Dipping Station o Line # 10 - Evaporator for Acid Vapor Generation o Line # 11 - Diced Wafer Frame Unit o Line # 12 - Wafer Frame Support o Line # 13 - Needle Die Ejecting Module o Line # 14 - Tape on Reel Support and Interface o Special Design o Line # 15 - SECS/GEM Protocol (Stream 1 and 12) o FC 300 Additional Recommended Options o Line # 16 - Bond Head Ultra Sonic o Feeding Module Options o Line #17 - Tray Support for 2-Inch Trays
Suss Microtec - FC300
Flip Chip Bonder