CTR Compact Thermal Reactor

Thermal Solutions

There are many thermal process steps in the manufacture of wafers either Silicon, SiC, iii-V or other materials.

Tool selection depends on lots of factors

Process

• Film Needs
• Low Stress
• Uniform
• Conformal Coating
• Flexible Recipies

Throughput

• Small Batch Handling
• Compatible Process
• Manual / Auto Loading
• Simultaneous or single processing

Easy Installation

• Installation Options
• Through Wall
• Stackable

Diffusion/LPCVD Furnaces

Process control is essential - utilising the latest PLC controller recipies are managed easiliy and effectively

Benefits of: the smaller footprint, batch furnace solution.

• Lower Overhead, Installation and Running Costs
• Scaleable Production & Process Performance
• Fully automated, recipe driven
• Small space saving footprint
• Ideal solution for pilot lines, R&D labs

The CTR provides an exceptionally small footprint system and is stackable. Providing both atmospheric pressure and LPCVD processes, the CTR is an ideal solution for pilot lines, R&D labs, and government and university laboratories.

Typical Installations

Models:

• Model CTR-125 – processes substrates up to 125mm diameter.
• Model CTR-150 – processes substrates up to 150mm diameter.
• Model CTR-200 – extends the processing range to 200mm diameter substrates. (Processes 125mm and 156mm square substrates, too).
• Model CTR-300 – processes substrates up to 300mm diameter substrates (in development, expected late 2024).