Dicing and Singulation
Getting a process that is both consistent, efficient and cost effective is not easy so we can help you with several solutions.
We understand the issues of the process and the risks to your devices at this very vulnerable stage. Dicing can also induce failures that impact yield significantly.
- Kerf Control
- Corrosion inhibition
- Blade Life
- Structures & dust traps
- Device Reliability
- Thin or stressed wafers
- Laser or traditional cutting
A dicing environment can make or break profitability. Your wafers are at their most vulnerable at this point and their most valuable. Process induced defects or damage must be minimised.
Most people don't understand fully that long term reliability of devices can be influenced greatly by this process step. It's very important to get it right!
Diamond Blade or Laser
Dicing as a Service
If you only have one or two wafers you need to dice then wafers can be diced in Europe depending on need - please contact us for details
Protect and make more profit!
Blade life, chipping and kerf control as well as bond strength and long-term corrosion can all impact product lifetime and costly return or recalls.
We can provide a variety of specialist dicing blades both hubbed and hubless ASK for a FREE TRIAL that can SAVE YOU MONEY!
Customers often need something specific for their needs. Blades can be configured to suit using best practice and expertise.
Diamaflow consistently beats the competition in terms of performance, and overall cost.
Your customer returns will be minimised and your quality and consistency of cut will improve. Added with our range of dispense systems Diamaflow can be cost effective in every environment and there are several formulas depending on your need
A sample of Diamaflow is FREE - you only pay shipping for the material and pump!
Data supports our claims so please contact us for more details and start getting better yields and long term reliability results today!