Dicing - Grinding - Lamination
Dicing and Singulation
Getting a process that is both consistent, efficient and cost effective is not easy so we can help you with several solutions.
We understand the issues of the process and the risks to your devices at this very vulnerable stage. Dicing can also induce failures that impact yield significantly.
- Kerf Control
- Corrosion inhibition
- Blade Life
- Particles
- Structures & dust traps
- Device Reliability
- Thin or stressed wafers
- Laser or traditional cutting
Protect and make more profit!
Blade life, chipping and kerf control as well as bond strength and long-term corrosion can all impact product lifetime and costly return or recalls.
Lamination and Mounting
Taping, Lamination and Delamination is utilised in various process from Dry Lithography to Dicing. Automating this process adds consisitency to your line.
From Taping-Detaping to Lamination of dry resist for lift-off processes there is a solution. Backside or topside options. The fully automatic systems ensure process consisitency.
Contact us to discuss your need
Surfactants
Diamaflow from Keteca consistently beats the competition in terms of performance, and overall cost. We can provide variants for different problems
Your customer returns will be minimised and your quality and consistency of cut will improve. Added with our range of dispense systems Diamaflow can be cost effective in every environment and there are several formulas depending on your need
A sample of Diamaflow is FREE - you only pay shipping for the material and pump!
The ADS range of products ensure consistency in the dicing process by controlling the mixture of surfactant and water. The ADS-ADV (advanced) tools are the smartest tools in the industry to cope with water fluctuation and constent point of use control of surfactant. Date lagging is all part of the process control regime.
